(AGENPARL) - Roma, 20 Marzo 2026 -
The project refers to a Lending Envelope under the Thematic Innovation – Research, Innovation and Digitalisation Window (RIDW) of the InvestEU programme for investments comprising Thematic Venture Debt (Equity Type) operations, eligible including: 1.2 Future Tech; and 1.3 Areas of strategic importance, as well as any additional requirements defined by the specific financing sources forming part of the Envelope.
The Lending Envelope will be implemented in EU Member States as well as in other countries contributing to the InvestEU programme. The investments to be financed are expected to be implemented from 2026 to 2032, unless the facility is extended.(AGENPARL)