(AGENPARL) - Roma, 29 Giugno 2023 - (AGENPARL) – gio 29 giugno 2023 Source: Tokyo Institute of Technology
For immediate release: June 29, 2023
Headline: BBCube 3D: A Breakthrough in Semiconductor Integration and Data Transmission
Sub-headline:?Implementing CPU/GPU and Memory in a Hybrid 3D Approach
Overview: A technology for the three-dimensional integration of processing units and memory, as reported by researchers from Tokyo Tech, has achieved the highest attainable performance in the whole world, paving the way to faster and more efficient computing. Named “BBCube 3D,” this innovative stacked architecture achieves higher data bandwidths than state-of-the-art memory technologies, while also minimizing the energy needed for bit access.
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Best regards,
Emiko Kawaguchi
Public Relations Division
Tokyo Institute of Technology
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