(AGENPARL) - Roma, 22 Giugno 2023 - (AGENPARL) – WEST LAFAYETTE (U.S.) gio 22 giugno 2023 In its ongoing efforts to help the U.S. regain preeminence in the semiconductor industry, Purdue University and the Krach Institute for Tech Diplomacy at Purdue on June 15 signed memorandums of understanding with two research universities in Taiwan, the world’s largest producer of microchips. The MOUs are in partnership with research universities in Taiwan: National Yang Ming Chiao Tung University (NYCU) in Hsinchu and National Chengchi University (NCCU), a public research university in Taipei.

Fonte/Source: http://www.purdue.edu/newsroom/releases/2023/Q2/purdue-signs-tech-focused-mous-with-taiwan-universities-krach-institute-for-tech-diplomacy-hosts-taiwan-delegation-and-ambassador-bi-khim-hsiao.html