(AGENPARL) – WEST LAFAYETTE (U.S.) mer 19 aprile 2023 Leaders from industry, government and academia convened at a summit Tuesday (April 18) in Washington, D.C. to forge national solutions at scale to address the future of U.S. innovation in microelectronics and the semiconductor workforce.
Fonte/Source: http://www.purdue.edu/newsroom/releases/2023/Q2/purdue-convenes-chips-summit-in-d.c-with-sec-raimondo-and-sen-young-announces-sustainability-index-and-facility-investment.html